The technique of depositing a thin layer of metal onto a substrate or a thin layer previously obtained is called surface deposition. "Thinness" here is a relative concept, but most deposition techniques can control the thickness of the thin layer within the range of a few to tens of nanometers, and molecular beam epitaxy can obtain a single atomic layer structure.
Deposition technology has applications in optical instruments (anti-reflection film, anti-reflection film, self-cleaning surface, etc.), electronic technology (thin film resistors, semiconductors, integrated circuits), packaging and modern art. When the film thickness is not high, techniques similar to deposition are often used. For example, the purification of copper by electrolysis, the deposition of silicon, and the purification of uranium all use processes similar to chemical meteorological deposition.
The deposition technology is mainly vapor deposition method, which can be divided into two categories: chemical vapor deposition (CVD) method and physical vapor deposition (physical vapor deposition) method according to the principle.
The PVD method has unique advantages over the CVD method. Therefore, in the preparation process of the metal multilayer film, the PVD method is mostly used.
The PVD method can take many different forms, such as vacuum evaporation deposition, sputtering deposition, ion beam and ion beam irradiation deposition, molecular beam epitaxy deposition, pulsed laser deposition, ionized cluster beam deposition, pulsed arc deposition and so on.
